中文版 | English
Tips for reducing impedance and crosstalk problems of high-speed connectors!
Author:深圳金科基科科技Date:2021-10-25View:678
In order to minimize the impedance effect of high-speed connector, the shape of connector contact must be carefully selected to make the impedance performance meet the specification. However, since the multi Gigabit system uses almost only LVDS (low voltage differential signal), the differential impedance of the contact arrangement must be 100 ohms. If possible, the impedance of each contact shall be 50 ohms to ensure good transmission of standard signals.
In order to reduce crosstalk, shielding can be introduced if the contact spacing is insufficient. However, at high contact density, the main cause of impedance discontinuity and crosstalk is the area where the connector is connected to the PCB. The small through hole on PCB is the best solution. The capacitance of the through hole should be kept to the minimum, and the maximum space should be reserved for the routing between the through holes. The small through hole diameter will also increase the spacing between the holes, so as to reduce crosstalk.

0755-27270011

扫一扫关注微信公众号